Dobon has developed a highly integrated, ultra-soft, stress-free, infinite gap-filling thermally conductive silicone pad.
In layman's terms, the stress-free thermal conductive gel pad is a playdough-like thermal conductive silicone sheet, can be compressed into a variety of shapes, to fill a variety of irregular gaps, maximizing the effective contact area of heat conduction, stress-free thermal conductive pad can be a perfect one-time solution to a PCB board with multiple chips and multiple thicknesses of the heat dissipation problem. But the stress-free thermal conductive adhesive pads as a highly functional thermal conductive material.
Stress-free thermal conductive adhesive pads, thermal conductivity of 4.5/5.0/8.0W/M * K, as long as the pressure is very light, can be compressed to fill the gap, and do not have to worry about the stress generated by the stress-free thermal conductive adhesive pads will compress the chip or IC components, which is very important because with the rapid development of electronic industrial products, products for the requirements of the industrial design of the higher and higher, and accordingly on the Product structure requirements and restrictions are also more and more, so there are often a lot of internal structure of the product is uneven, or even a lot of small holes and gap filler pad, for such a design, the traditional thermal conductive silicone sheet is difficult to achieve perfect heat dissipation requirements. Because of the hardness of the thermal conductive silicone sheet, even if the hardness of the very soft thermal conductive silicone sheet, after compression, there will still be stress. I have encountered several similar customers, recommended to customers a very soft thermal conductive silicone film, customers due to structural constraints, a piece of 2mm thickness of the thermal conductive silicone film affixed to a piece of uneven PCB board, some of the places where the pitch is just 2mm, some of the places 1.2mm, and even some of the places from the 2mm are compressed to 0.8mm, because the thermal conductive silicone film is very soft, in the assembly of the Completely without the feeling of compression, the material has not been crushed, thermal conductivity also fully meet customer requirements, this would have been a perfect ending, the author recommended to the customer's material from the softness, toughness, compression, thermal conductivity, is undoubtedly a good thermal conductive silicone film. But often the end is unexpected, thermal performance, structure are solved, but in the final overall test, the electrical performance of the error, the IC data value of different degrees of fluctuations, the reason is also very simple, out of the thermal conductive silicone film, because of the infinite compression of the thermal conductive silicone film to release the stress, the role of the stress, the IC chip parameters fluctuations.
Therefore, the existence and value of stress-free thermal conductive adhesive gasket is obvious, Dobon immediately replaced the stress-free thermal conductive adhesive gasket to the customer to test again, this time the end is very perfect, because the stress-free thermal conductive adhesive gasket is a piece of thermal conductive adhesive packaged into a sheet, stress-free thermal conductive adhesive gasket in the end what degree of friendliness? You can ravage it at will, compressed it, stress-free thermal conductive adhesive gaskets can go against the grain, you let it fill the gap it fill the gap, you let it instantly from 2mm into 0.5mm, stress-free thermal conductive adhesive gaskets can be met, the most important thing is that it does not rebel, because stress-free thermal conductive adhesive gaskets can be said to be virtually stress-free, will not go to the IC squeeze, will not go to the chip, so that the customer's products from the Thermal performance, structural design, electrical performance, to the complete product performance to meet the product manager of the product design intention.
Dobong CP300 3W Ultra soft thermal pad has the characteristics of ultra-low hardness and high compressibility. Compared with common thermal pad, it has ultra-low installation stress, which can avoid the damage of installation stress to chip or circuit board. It is suitable for occasions with high installation stress requirements and large tolerance.
Features
- High compressibility, low installation stress
- Lower contact thermal resistance
- Adapt to larger tolerance occasions
- Excellent thermal conductivity
- Wide temperature range from -40°C ~ 150°C
- RoHS compliant
Applications
- Automotive electronics
- Household electrical appliances
- Wearable devices
- Assemble stress sensitive chip
- Environment with large tolerance
Ultra soft thermal pads are superior to the usual thermal pads in many respects, they can be used over a much longer period of time without significantly losing performance. Ultra soft thermal pads are specially designed for applications requiring improved thermal conduction between components. They provide excellent thermal performance in a wide range of temperatures, making them ideal for notebook computers, servers, communication equipment, and other high-end electronic devices.
Stress-free thermal pads can be a perfect solution to a PCB board with a variety of thickness gap heat dissipation problems, if your PCB board is exactly this structure, then please try Dobon this stress-free thermal pads, Dobon stress-free thermal pads can help you to solve all at once!